Magnetic memory device and method of fabricating the same

ABSTRACT

A magnetic memory device includes a common line; a first write-in diode, a readout diode and a second write-in diode being connected to the common line in parallel. The magnetic memory device further includes a magnetic tunnel junction structure connected to the readout diode, first and second write-in conductors disposed at both sides of the magnetic tunnel junction structure and connected to the first and second write-in diodes, respectively and a first write-in line, a readout line and a second write-in line, which are connected to the first write-in conductor, the magnetic tunnel injection structure, and the second write-in conductor, respectively.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.12/507,504 filed on Jul. 22, 2009 now U.S. Pat. 7,851,878, which is adivisional of U.S. patent application Ser. No. 11/480,242 filed on Jun.30, 2006, now U.S. Pat. No. 7,582,941 issued Sep. 1, 2009, which claimspriority to Korean Application No. 2005-78365 filed Aug. 25, 2005, thedisclosures of which are each hereby incorporated by reference herein intheir entireties.

BACKGROUND

The present disclosure relates to semiconductor devices and methods offabricating the same, and in particular relates to magnetic memorydevices and methods of fabricating the same.

Magnetic memory devices are typically defined, for example, aselectronic components storing data in a nonvolatile capacity, and whichinclude magnetic tunnel junction (MTJ) structures in which theresistance value varies according the magnetization direction onmagnetic layers. Moreover, there is an increasing demand for magneticmemory devices because of, for example, their ability to operate at highfrequencies and their re-writing properties. For example, an MTJconfiguration may be composed of, two magnetic layers and a tunnelingbarrier layer interposed between the magnetic layers. The resistancevalue of the MTJ structure when the magnetization direction of each ofthe two magnetic layers are arranged in the same direction may besmaller than the resistance value for the MTJ structure when themagnetization direction of the two magnetic layers are aligned inreverse directions to each other. Furthermore, the magnetizationdirection of each of the above two magnetic layers may be stored asinformation data in the MTJ as logical values “1” or “0”.

Typically, a magnetic memory cell having a MTJ structure is arranged bybeing connected to bit and digit lines. Such a magnetic memory cell isillustrated as follows.

FIG. 1 is a sectional view showing a conventional magnetic memorydevice. Referring to FIG. 1, a lower interlevel oxide film 2 is disposedon a semiconductor substrate 1 and a digit line 3 is arranged on thelower interlevel oxide film 2. An intermediate interlevel oxide film 4covers the digit line 3 and the lower interlevel oxide film 2. A lowerplug 5 penetrates the intermediate and lower interlevel oxide films 4and 2 in sequence to be connected to the semiconductor substrate 1. Thelower plug 5 is laterally isolated from the digit line 3. The lower plug5 is connected to source/drain regions of a MOS transistor (not shown)formed in the semiconductor substrate 1.

A cell electrode 6 is disposed on the intermediate interlevel oxide film4. The cell electrode 6 meets with an upward face of the lower plug 5and then laterally extends to cover the digit line 3. The cell electrode6 is insulated from the digit line 3 through the intermediate interleveloxide film 4.

An MTJ structure 10 is disposed on the cell electrode 6. The MTJstructure 10 is aligned to overlap with the digit line 3. The MTJstructure is composed of a first magnetic layer 7, a tunnel barrier 8,and a second magnetic layer 9. The first magnetic layer 7 is fixed inthe direction of the magnetization moment. However, the second magneticlayer 9 may be varied by an external electric field.

Moreover, an upper interlevel oxide film 11 covers the cell electrode 6and the MTJ structure 10. An upper plug 12 penetrates the upperinterlevel oxide film 11, which is connected to the MTJ structure 10. Abit line is interposed on the upper interlevel oxide film 11, crossingover the digit line 3. The bit line 13 is connected with the upper plug12. The bit line 13 is aligned to overlap with the MTJ structure 10. Inother words, the MTJ 10 structure is interposed between the digit line 3and the bit line 13, which intersect with each other. Here, the MTJstructure is electrically connected to the bit line 13 but insulatedfrom the digit line 3. The bit line 13, the MTJ structure 10, the cellelectrode 6, and the lower plug 5 form a current path to read out a databit.

A unit cell of the magnetic memory device is comprised of the MTJstructure 10, and the digit and bit lines 3 and 13. The digit line 3 isshared by pluralities of unit cells that are arranged in parallel, whilethe bit line 13 is shared by pluralities of unit cells that are arrangedin parallel with the pluralities of the bit lines. In a cell array ofthe magnetic memory device, pluralities of the digit lines 3 arearranged in parallel along a direction and the pluralities of the bitlines 13 cross over the digit lines 3 in parallel.

The above-mentioned conventional magnetic memory device is programmedthrough an electric field as a vector sum of a first electric fieldinduced by the digit line 3 and a second electric field induced by thebit line 13. Namely, the vector-summed electric field programs a databit into a selective one among the pluralities of the MTJ structures 10arranged in a second-dimensional pattern. When programming dataaccording to the above conventional manner, the digit line 3, the MTJstructure 10, and the bit line 13 should be efficiently aligned orarranged.

However, it may be difficult to accomplish an efficient arrangementamong the MTJ structure 10 and the digit and bit lines 3 and 13. Forexample, a way of arranging the MTJ structure 10 and the digit and bitlines 3 and 13 may be carried out such that after aligning the MTJstructure 10 to the digit line 3, the bit line 13 is aligned to the MTJstructure 10. Nevertheless, with the above conventional approach, therestill may be difficulties in achieving an alignment among the MTJstructure 10 and the lines 3 and 13 because of a coupling effect whichmay occur between the MTJ structure 10 and the digit line 3 and betweenthe bit line 13 and the MTJ structure 10. The above-mentioned alignmentdifficulty may result in deviations occurring among the unit cellsarranged in second-dimensional patterns. Such alignment deviations mayincrease as the magnetic memory device become more highly integrated,which in turn may cause program disturbance such as the program failureof selected cells or data changes of deselected cells. Consequently, theabove program disturbance may result in an increase in the defect rateof the magnetic memory device.

Thus, there is a need for a magnetic memory device which minimizes theoccurrence of program disturbance and for a method of forming the same.

SUMMARY OF THE INVENTION

In accordance with an exemplary embodiment of the present invention, amagnetic memory device is provided. The magnetic memory device includesa common line; a first write-in diode, a readout diode and a secondwrite-in diode being connected to the common line in parallel. Themagnetic memory device further includes a magnetic tunnel junctionstructure connected to the readout diode, first and second write-inconductors disposed at both sides of the magnetic tunnel junctionstructure and connected to the first and second write-in diodes,respectively and a first write-in line, a readout line and a secondwrite-in line, which are connected to the first write-in conductor, themagnetic tunnel injection structure, and the second write-in conductor,respectively.

In some exemplary embodiments of the present invention, the firstwrite-in conductor applies an electric field of a first direction to themagnetic tunnel junction structure during a first programming mode,while the second write-in conductor applies an electric field of asecond direction to the magnetic tunnel junction structure during asecond programming mode. During this, the first direction is reverse tothe second direction. In this case, forward output terminals of thereadout, first, and second write-in diodes are connected to the commonline, while forward input terminals of the readout, first, and secondwrite-in diodes are each connected to the magnetic tunnel junctionstructure, and the first and second write-in conductors. Otherwise, theforward input terminals of the readout, first, and second write-indiodes are connected to the common line, while the forward outputterminals of the readout, first, and second write-in diodes are eachconnected to the magnetic tunnel junction structure, and the first andsecond write-in conductors.

According to an exemplary embodiment by the invention, a magnetic memorydevice is provided. The magnetic memory device includes a deviceisolation film confining an active region at a substrate doped withimpurities of a first conductivity, a common line formed in the activeregion, being doped with impurities of a second conductivity, a firstwrite-in semiconductor pattern, a readout semiconductor pattern andsecond write-in semiconductor pattern, which are disposed on the commonline laterally separated from each other, and which are doped withimpurities of the first conductivity. The magnetic memory device furtherincludes a magnetic tunnel junction structure electrically connected tothe readout semiconductor pattern and disposed on the readoutsemiconductor pattern, first and second write-in conductors eachdisposed on the first and second write-in semiconductor patterns at bothsides of the magnetic tunnel junction structure, with the first andsecond write-in conductors each being electrically connected each to thefirst and second write-in semiconductor patterns, a readout lineelectrically connected to the magnetic tunnel junction structure, andfirst and second write-in lines each electrically connected to the firstand second write-in conductors.

In accordance with another exemplary embodiment of the invention, amethod of fabricating a magnetic memory device is provided. The methodincludes forming a device isolation film to confine an active region ata substrate doped with impurities of a first conductivity, forming acommon line with impurities of a second conductivity in the activeregion, forming a first write-in semiconductor pattern, a readoutsemiconductor pattern and a second write-in semiconductor pattern, whichare each disposed on the common line laterally separated from eachother, and with each being doped with impurities of the firstconductivity and forming a magnetic tunnel junction structure on thereadout semiconductor pattern. The magnetic tunnel junction structure iselectrically connected to the readout semiconductor pattern. The methodfurther includes forming first and second write-in conductors each onthe first and second write-in semiconductor patterns at both sides ofthe magnetic tunnel junction structure, such that the first and secondwrite-in conductors are each electrically connected with the first andsecond write-in semiconductor patterns, forming a readout line which iselectrically connected to the magnetic tunnel junction structure; andforming first and second write-in lines which are each electricallyconnected with the first and second write-in conductors.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary Embodiments of the present invention can be understood in moredetail from the following description taken in conjunction with theaccompanying drawing, in which:

FIG. 1 is a sectional view showing a conventional magnetic memorydevice;

FIG. 2A is an electrically equivalent circuit illustrating an unit cellin accordance with an exemplary embodiment of the invention;

FIG. 2B is an electrically equivalent circuit illustrating amodification of the unit cell in accordance with an exemplary embodimentby the invention;

FIG. 3 is an electrically equivalent circuit illustrating a cell arraywith a plurality of the unit cell shown in FIG. 2A;

FIG. 4 is a plan view illustrating a layout pattern of the magneticmemory device in accordance with an exemplary embodiment by theinvention;

FIG. 5 is a sectional view taken along with the line I-I′ of FIG. 4;

FIG. 6 is a sectional view taken along with the line II-II′ of FIG. 4;

FIG. 7 is a sectional view taken along with the line III-III′ of FIG. 4;

FIGS. 8 through 13 are sectional views illustrating processing steps tofabricate the magnetic memory device in accordance with an exemplaryembodiment of the invention, taken along with the line I-I′ of FIG. 4;

FIGS. 14A through 16A are sectional views illustrating processing stepsto form diodes of the magnetic memory device in accordance with anexemplary embodiment of the invention, taken along with the line I-I′ ofFIG. 4; and

FIGS. 14B through 16B are sectional views illustrating processing stepsto form diodes of the magnetic memory device in accordance with anexemplary embodiment of the invention, taken along with the line II-II′of FIG. 4.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Exemplary embodiments of the present invention will be described belowin more detail with reference to the accompanying drawings. The presentinvention may, however, be embodied in different forms and should not beconstructed as limited to the exemplary embodiments set forth herein.

FIG. 2A is an electrically equivalent circuit illustrating a unit cellin accordance with an exemplary embodiment of the invention, and FIG. 3is an electrically equivalent circuit illustrating a cell array with aplurality of the unit cell shown in FIG. 2A.

Referring to FIG. 2A, the unit cell includes a common line CL extendingalong a direction. A readout diode is connected to the common line CL.First and second write-in diodes WD1 and WD2 are disposed at both sidesof the readout diode RD. The first and second write-in diodes WD1 andWD2 are electrically connected with the common line CL. The firstwrite-in diode WD1, the readout diode RD, and the second write-in diodeWD2 are connected in parallel with the common line CL.

A magnetic tunnel junction (MTJ) structure is electrically connected toan end of the readout diode RD. First and second write-in conductors WE1and WE2 are disposed at both sides of the MTJ structure. Here, the firstand second write-in conductors WE1 and WE2 are electrically connected toends of the first and second write-in diodes WD1 and WD2, respectively.In other words, the readout diode RD and the MTJ structure are connectedin series from the common line CL. The first write-in diode andconductor WD1 and WE1 are also connected in series from the common lineCL and disposed at a side of the readout diode RD. In addition, thesecond write-in diode and conductor WD2 and WE2 are also connected inseries from the common line CL and disposed at the other side of thereadout diode RD.

Each of the diodes RD, WD1, and WD2 has forward input and outputterminals. The forward input terminal is defined as a port through whicha current flows into the diode when a forward bias voltage is applied tothe diode, while the forward output terminal is defined as a port fromwhich a current flows out of the diode when a forward bias voltage isapplied to the diode. Thus, if currents are input through the forwardinput terminals of the diodes RD, WD1 and WD2, these currents flowsmoothly through the diodes RD, WD1 and WD2. To the contrary, ifcurrents are input through the forward output terminals of the diodesRD, WD1 and WD2, these currents do not flow through the diodes RD, WD1and WD2.

As illustrated in FIG. 2A, the forward output terminals of the diodesRD, WD1, and WD2 may be connected with the common line CL in parallel.In this case, the MTJ structure is connected to the forward inputterminal of the readout diode RD, while the first and second write-inconductors WE1 and WE2 are connected to the forward input terminals ofthe first and second write-in diodes WD1 and WD2, respectively.

A readout line RL is electrically connected to the MTJ structure, whilefirst and second write-in lines WL1 and WL2 are electrically connectedeach to the first and second write-in conductors WE1 and WE2,respectively. The readout line RL, and the first and second write-inlines WL1 and WL2 may cross over the common line CL in parallel. Thereadout line RL, and the first and second write-in lines WL1 and WL2 areconnected in series to the MTJ structure, and the first and secondwrite-in conductors WE1 and WE2, respectively.

The MTJ structure is composed of a first magnetic layer PM with a fixedmagnetization direction, a second magnetic layer FM with a changeablemagnetization direction, and a tunnel barrier layer TB interposedbetween the first and second magnetic layers PM and FM. Themagnetization direction of the first magnetic layer PM is fixed on adirection during a programming operation, while the magnetizationdirection of the second magnetic layer FM may be varied or changedduring the programming operation. The magnetization direction of thesecond magnetic layer FM, which has been varied during the programmingoperation, may be maintained without change in a reading operation. Theresistance value of the MTJ structure when the magnetization directionsof the first and second magnetic layers PM and FM are the same may bethe resistance value of the MTJ structure when the magnetizationdirections of the first and second magnetic layers PM and FM are thereverse.

As also illustrated in FIG. 2A, the first magnetic layer PM may beconnected to the readout diode RD, while the second magnetic layer FM isconnected to the readout line RL. Otherwise, the first magnetic layer PMmay be connected to the readout line RL, while the second magnetic layerFM is connected to the readout diode RD.

A second-dimensional arrangement with the magnetic memory cellsaforementioned is shown in FIG. 3.

Referring to FIG. 3, a plurality of magnetic memory cells are arrangedin the second dimension along rows and columns. The magnetic memorycells arranged along each row are connected to a common line CL. Aplurality of the common lines CL are arranged in parallel along therows. The magnetic memory cells arranged along each column are connectedto a first write-in line WL1, a readout line RL, and a second write-inlines WL2. The readout line RL, and the first and second write-in linesWL1 and WL2 are referred to as a cell line set. A plurality of the cellline sets are arranged in parallel along the columns.

The programming operation of the magnetic memory device including theunit cells and the cell array will now be discussed in more detail.

Referring to FIGS. 2A and 3, the programming operation in the magneticmemory device may be divisionally carried out through first and secondprogramming modes. One of the first and second programming modes is toturn the resistance value of the MJT structure to be lower, while theother of the first and second programming modes is to turn theresistance value of the MJT structure to be higher.

During the first programming mode, the first write-in conductor WE1applies an electric field of a first direction (hereinafter,first-directional electric field) to the MJT structure. It is preferredfor the second write-in conductor WE2 not to generate an electric fieldduring the first programming mode. During the second programming mode,the second write-in conductor WE2 applies an electric field of a seconddirection (hereinafter, second-directional electric field) to the MJTstructure. It is preferred for the first write-in conductor WE1 not togenerate an electric field during the second programming mode. At thispoint, the first direction is reverse to the second direction. Themagnetization direction of the first magnetic layer PM is fixed to oneof the first and second directions.

The first programming mode will now be described in more detail. A firstwrite-in voltage is applied to the first write-in line WL1 connected toa selected magnetic memory cell. A first common voltage is applied tothe common line CL connected to the selected cell. The first write-involtage is higher than the first common voltage. According to these biasconditions, a forward voltage is set on the first write-in diode WD1 inthe selected cell, so that a first write-in current flows through thefirst write-in diode WD1. By the action of the first write-in current,the first-directional electric field is applied to the MTJ structure inthe selected cell. As a result, the magnetization direction of thesecond magnetic layer FM in the MTJ structure can be arranged in thefirst direction.

During the first programming mode, it is preferable that the readoutline RL and the second write-in line WL2 connected to the selected cellare supplied with a voltage equal to or lower than the first commonvoltage. Accordingly, to both ends of the readout diode RD and thesecond write-in diode WD2, the same or a reverse voltage is applied tomake the readout diode RD and the second write-in diodes WD2 turn off.As a result, there is no current flow through the MTJ structure and thesecond write-in conductor WE2, such that the progress of the firstprogramming mode is not affected. In addition, it is preferable to applya voltage equal to or lower than the first common voltage to thedeselected readout lines RL, and the deselected first and secondwrite-in lines WL1 and WL2. The deselected common lines CL arepreferably supplied with a voltage equal to or higher than the firstwrite-in voltage. Thus, the diodes, RD, WD1, and WD2, of the deselectedcells are turned off.

Next, the second programming mode will now be described in more detailas follows. For example, a second write-in voltage is applied to thesecond write-in line WL2 connected in a selected cell, while a secondcommon voltage is applied to the common lines CL connected to theselected cell. The second write-in voltage is higher than the secondcommon voltage. According to these bias conditions, a forward voltage isset on the second write-in diode WD2 in the selected cell, which makes asecond write-in current flow through the second write-in diode WD2. Thesecond write-in current flows in the same direction with the firstwrite-in current. By the flow of the second write-in current, thesecond-directional electric field is applied to the MTJ structure of theselected cell. As a result, the magnetization direction of the secondmagnetic layer FM in the MTJ structure can be arranged in the seconddirection.

During the second programming mode, it is preferable that the readoutline RL and the first write-in line WL1 connected to the selected cellare supplied with a voltage equal to or lower than the second commonvoltage. In addition, it is preferable to apply a voltage equal to orlower than the second common voltage to the deselected readout lines RL,and the deselected first and second write-in lines WL1 and WL2. Thedeselected common lines CL are preferably supplied with a voltage equalto or higher than the second write-in voltage.

As stated above, the first and second write-in conductors WE1 and WE2are each disposed at both sides of the MTJ structure. Thus, the firstand second write-in currents flowing in the same direction are able tosupply the MTJ structure with the first-directional electric field orthe second-directional electric field that is reverse to thefirst-directional electric field.

Now, the reading operation for the magnetic memory cell will now bedescribed in more detail. For example, a readout voltage is applied tothe readout line RL connected to a selected cell, while a third commonvoltage is applied to the common line CL connected to the selected cell.The readout voltage is preferably higher than the third common voltage.According to these bias conditions, a forward voltage is set on thereadout diode RD in the selected cell, which makes a readout currentflow through the readout diode RD in the selected cell. Data may be readout from the MTJ by sensing variation rates of the readout currentor/and voltage along the resistance of the MTJ structure.

During the reading operation, it is preferable that the first and secondwrite-in lines WL1 and WL2 in the selected cell are supplied with avoltage equal to or lower than the third common voltage. In addition, itis preferable to apply a voltage equal to or lower than the third commonvoltage to the deselected readout lines RL, and the deselected first andsecond write-in lines WL1 and WL2. The deselected common lines CL arepreferably supplied with a voltage equal to or higher than the readoutvoltage.

One of the readout line RL and the common line CL is correspondent witha bit line, while the other is correspondent with a word line. In otherwords, the readout line RL may be the word line and the common line CLmay be the bit line. To the contrary, the readout line RL may be the bitline and the common line CL may be the word line.

The magnetic memory cell of the present exemplary embodiment includesthe first write-in conductor WE1, in which the first programming mode isexecuted only by means of the electric field generated from the firstwrite-in conductor WE1. Further, the magnetic memory cell includes thesecond write-in conductor WE2, in which the second programming mode isexecuted only by means of the electric field generated from the secondwrite-in conductor WE2. Namely, the magnetic memory cell of the presentexemplary embodiment does not need a conventional vector-summed electricfield for programming or a conventional alignment process. As a result,the magnetic memory device of the present exemplary embodiment mayminimize program disturbance and provide high processing margin inmanufacturing the magnetic memory cell in comparison to conventionalmagnetic memory devices and processes.

Moreover, in the present exemplary embodiment, the readout diode, andthe first and second write-in diodes are connected to the common line CLthrough their forward output terminals. Otherwise, the forward inputterminals of the diodes may be connected to the common line in parallel.

FIG. 2B is an electrically equivalent circuit illustrating amodification of the unit cell of the magnetic memory cell in accordancewith an exemplary embodiment of the invention.

Referring to FIG. 2B, a readout diode RD′, and first and second write-indiodes WD1′ and WD2′ are connected to a common line CL in parallelthrough their forward input terminals. The first write-in conductor WE1is connected to the forward output terminal of the first write-in diodeWD1′, the MTJ structure is connected to the forward output terminal ofthe readout diode RD′, and second write-in conductor WE1 is connected tothe forward output terminal of the second write-in diode WD2′.

The reading and programming operations of the modified feature of themagnetic memory cell of the present exemplary embodiment of theinvention will now be described in more detail. The programmingoperation with this modified cell is also divided into first and secondprogramming modes.

First, referring to FIG. 2 b, in the first programming mode, a firstwrite-in voltage and a first common voltage are applied to the firstwrite-in line WL1 and the common line CL, respectively. The first commonvoltage is higher than the first write-in voltage. Thus, a forwardvoltage is applied to the first write-in diode WD1′, enabling a firstwrite-in current to flow through the first write-in conductor WE1connected to the first write-in diode WD1′. The first write-in currentmakes the first-directional electric field set around the MTJ structure.

During the first programming mode, it is preferable to supply thereadout line RL and the second write-in line WL2 with a voltage equal toor higher than the first common voltage. Consequently, the readout diodeRD′ and the second write-in diode WD2′ are turned off. In theconfiguration with a cell array composed of the magnetic memory cellshaving such diodes RD′, WD1′, and WD2′, it is preferable to supply thedeselected readout lines, and the deselected first and second write-inlines with the voltage equal to or higher than the first common voltage.The deselected common lines are preferably supplied with a voltage equalto or lower than the first write-in voltage. Thus, the diodes RD′, WD1′,and WD2′ included in the deselected cells are turned off.

In the second programming mode, a second write-in voltage and a secondcommon voltage are applied to the second write-in line WL2 and thecommon line CL, respectively. The second common voltage is higher thanthe second write-in voltage. Thus, a forward voltage is applied to thesecond write-in diode WD2′, enabling a second write-in current to flowthrough the second write-in conductor WE2 connected to the secondwrite-in diode WD2′. The second write-in current makes thesecond-directional electric field set around the MTJ structure. Thefirst and second directions of the electric fields generated by thefirst and second write-in conductors WE1 and WE2 are reverse to eachother.

During the second programming mode, it is preferable to supply thereadout line RL and the first write-in line WL1 with a voltage equal toor higher than the second common voltage. Consequently, the readoutdiode RD′ and the first write-in diode WD1′ are turned off. In theconfiguration with a cell array composed of the magnetic memory cellshaving such diodes RD′, WD1′, and WD2′, it is preferable to supply thedeselected readout lines, and the deselected first and second write-inlines with the voltage equal to or higher than the second commonvoltage. The deselected common lines are preferably supplied with avoltage equal to or lower than the second write-in voltage. Thus, thediodes RD′, WD1′, and WD2′ included in the deselected cells are turnedoff.

In the reading operation for the magnetic memory cell shown in FIG. 2B,a readout voltage is applied to the readout line RL, while a thirdcommon voltage higher than the readout voltage is applied to the commonline CL. According to these bias conditions, a forward voltage is set onthe readout diode RD′, enabling data to be read out from the MTJstructure. It is preferable that the first and second write-in lines WL1and WL2 are supplied with a voltage equal to or higher than the thirdcommon voltage, turning the first and second write-in diodes WD1′ andWD2′ off. In the configuration of a cell array with the magnetic memorycells as shown in FIG. 2B, it is preferable to apply a voltage equal toor higher than the third common voltage to the deselected readout lines,and the deselected first and second write-in lines. The deselectedcommon lines are preferably supplied with a voltage equal to or lowerthan the readout voltage. Thus, the diodes RD′, WD1′, and WD2′ of thedeselected cells are turned off.

Moreover, from the directional difference between the first and secondwrite-in diodes WD1 and WD2 of FIG. 2A and the first and second WD1′ andWD2′ of FIG. 2B, the write-in currents of the write-in conductors WE1and WE2 shown in FIG. 2A flow in the direction reverse to those of thewrite-in conductors shown in FIG. 2B. Therefore, the first andsecond-directional electric fields described relevant to FIG. 2A arereverse to those described relevant to FIG. 2B.

FIG. 4 is a plan view illustrating a layout pattern of the magneticmemory device in accordance with an exemplary embodiment by theinvention, and FIGS. 5, 6, and 7 are sectional views taken along withthe lines I-I′, II-II′, and III-III′ of FIG. 4.

Referring to FIGS. 4, 5, 6, and 7, device isolation films 104 are formedto confine active regions 105 in a semiconductor substrate 100. Theactive regions 105 are defined in the pattern of lines extending along adirection. On the substrate 100, pluralities of the lineal activeregions 105 are arranged in parallel with each other on the substrate100.

In the active regions 105, common lines 106 doped withsecond-conductivity impurities are disposed extending along the activeregions 105. The common lines 106 are correspondent with the commonlines CL shown in FIGS. 2A and 2B. On the substrate 100, pluralities ofthe common lines 106 are arranged in parallel along the direction. Thecommon lines 106 may be doped with a high impurity concentration tolower resistivity.

Readout semiconductor patterns 122 are disposed on the common lines 106.Additionally, first and second write-in semiconductor patterns 124 a and124 b are each disposed at sides of the readout semiconductor pattern122. On the common lines 106, the first write-in semiconductor patterns124 a, the readout semiconductor patterns 122, and the second write-insemiconductor pattern 124 b are disposed in sequence. The readoutsemiconductor patterns 122, and the first and second write-insemiconductor patterns 124 a and 124 b are separated from each other.The readout semiconductor patterns 122, and the first and secondwrite-in semiconductor patterns 124 a and 124 b are doped withimpurities of the first-conductivity. The semiconductor patterns, 122,124 a, and 124 b, may be doped in a high concentration so as to reducethe resistivity thereof. The readout semiconductor patterns 122, and thefirst and second write-in semiconductor patterns 124 a and 124 bconstitute a group of cell semiconductor patterns. The plural cellsemiconductor pattern groups may be disposed on one of the common lines106, separated from each other.

One of the first and second-conductivity impurities may be, for example,an N-type impurity, while the other may be, for example, a P-typeimpurity.

The first write-in semiconductor pattern 124 a and the common line 106constitute the first write-in diode (WD1 or WD1′), the readoutsemiconductor pattern 122 and the common line 106 constitute the readoutdiode (RD or RD′), and the second write-in semiconductor pattern 124 band the common line 106 constitute the second write-in diode (WD2 orWD2′).

When the first conductivity is the P-type and the second conductivity isthe N-type, the readout semiconductor pattern 122, and the first andsecond semiconductor patterns 124 a and 124 b may constitute the firstreadout diode RD, and the first and second write-in diodes WD1 and WD2,shown in FIG. 2A, together with the common line 106. Otherwise, when thefirst conductivity is the N-type and the second conductivity is theP-type, the readout semiconductor pattern 122, and the first and secondsemiconductor patterns 124 a and 124 b may constitute the first readoutdiode RD′, and the first and second write-in diodes WD1′ and WD2′, shownin FIG. 2B, together with the common line 106.

The readout semiconductor pattern 122, and the first and secondsemiconductor patterns 124 a and 124 b may contact the common line 106directly. Otherwise, it may be constructed such that: the readoutsemiconductor pattern 123 and the common line 106 interpose a readoutbuffering pattern 118 therebetween, the first write-in semiconductorpattern 124 a and the common line 106 interpose a first write-inbuffering pattern 120 a therebetween and the second write-insemiconductor pattern 124 b and the common line 106 interpose a secondwrite-in buffering pattern 120 b therebetween. The buffering patterns,118, 120 a, and 120 b, are made of semiconductors doped with thesecond-conductivity impurities. In this case, the buffering patterns,118, 120 a, and 120 b, are preferably lower than the common line 106 inimpurity concentration. With the presence of the lightly-doped bufferingpatterns 118, 120 a, and 120 b between the semiconductor patterns 122,124 a, and 124 b and the common line 106, a leakage current may beminimized therein due to reverse voltage at the readout diode, and thefirst and second write-in diodes.

On the other hand, a predetermined region of the common line 106 may bea strapping region. This strapping region is provided to reduceresistance on the common line 106. Hereinafter the strapping region willnow be described in more detail. The strapping region may be disposed ata side of a cell string that is composed of the plural cellsemiconductor pattern groups arranged with equal distances.

A strapping semiconductor pattern 126 may be disposed on the strappingregion. The strapping semiconductor pattern 126 is doped withsecond-conductivity impurities and is electrically connected to thecommon line 106. The strapping semiconductor pattern 126 may be made upwith a high impurity concentration to reduce the resistivity therein.

A first insulation film 108 is formed on the substrate 100, covering thesubstrate surfaces around the semiconductor patterns 122, 124 a, 124 b,and 126. The upward face of the first insulation film 108 may be formedlevel with the upward faces of the semiconductor patterns 122, 124 a,124 b, and 126. The first insulation film 108, as shown in the figures,may not cover the upward faces of the semiconductor patterns 122, 124 a,124 b, and 126.

A buffering insulation film 128 may cover the first insulation film 108and the upward faces of the semiconductor patterns 122, 124 a, 124 b,and 126. An MTJ structure 148 is disposed on the buffering insulationfilm 128. The MTJ structure 148 is located over the readoutsemiconductor pattern 122. Between the MTJ structure 148 and the readoutsemiconductor pattern 122 is interposed a lower readout plug 130 thatpenetrates the buffering insulation film 128. The MTJ structure 148 iselectrically connected to the readout semiconductor pattern 122 by wayof the lower readout plug 130. The MTJ structure 130 corresponds withthe MTJ structure shown in FIG. 2A or 2B.

Respectively, on the first write-in semiconductor pattern 124 a, thesecond write-in semiconductor pattern 124 b, and the strappingsemiconductor pattern 126, a first lower write-in plug 132 a, a secondlower write-in plug 132 b, and a first strapping plug 134 may each bedisposed to penetrate the buffering insulation film 128. The first lowerwrite-in plug 132 a, the second lower write-in plug 132 b, and the firststrapping plug 134 are electrically connected to the first write-insemiconductor pattern 124 a, the second write-in semiconductor pattern124 b, and the strapping semiconductor pattern 126.

A second insulation film 150 covers the MTJ structure 148, the bufferinginsulation film 128, and the plugs 130, 132 a, 132 b, and 134. A firstwrite-in conductor 154 a penetrating the second insulation film 150 isdisposed on the first write-in semiconductor pattern 124 a, while asecond write-in conductor 154 b penetrating the second insulation film150 is disposed on the second write-in semiconductor pattern 124 b. Thefirst and second write-in conductors 154 a and 154 b are electricallyconnected with the first and second write-in semiconductor patterns 124a and 124 b, respectively. The first and second write-in conductors 154a and 154 b may each be connected with the first and second lowerwrite-in plugs 132 a and 132 b, electrically linking to the first andsecond write-in semiconductor patterns 124 a and 124 b, respectively.The first and second write-in conductors 154 a and 154 b are located atboth sides of the MTJ structure 148. The first and second write-inconductors 154 a and 154 b are laterally separated from the MTJstructure 148. The first and second write-in conductors 154 a and 154 bmay be formed in the shape of contact plugs, penetrating the secondinsulation film 150.

The first and second write-in conductors 154 a and 154 b arecorrespondent to the first and second write-in conductors WE1 and WE2shown in FIG. 2A or 2B. Namely, the first write-in conductor 154 a isused to supply the first-directional electric field to the MTJ structure148 during the first programming mode, while the second write-inconductor 154 b is used to supply the second-directional electric fieldto the MTJ structure 148 during the second programming mode. The firstdirection is reverse to the second direction. During the firstprogramming mode, a forward voltage is applied to the first write-indiode to flow the first write-in current through the first write-inconductor 154 a. During the second programming mode, a forward voltageis applied to the second write-in diode to flow the second write-incurrent through the second write-in conductor 154 b.

On the strapping semiconductor pattern 126, a second strapping plug 156is formed penetrating the second insulation film 150. The secondstrapping plug 156 is electrically connected to the common source line106 by way of the first strapping plug 134 and the strappingsemiconductor pattern 126. The strapping semiconductor pattern 126 maynot be present therein. In this case, the first strapping plug 134 mayextend downward to penetrate the first insulation film 108, directlycontacting the common line 106. Without the strapping semiconductorpattern 126 and the buffering insulation film 128, the first strappingplug 134 may penetrate only the first insulation film 108 to contact thecommon line 106. Otherwise, the second strapping plug 156 may directlycontact the strapping semiconductor pattern 126 or the common line 126without the first strapping plug 134.

On the upward face of the MTJ structure 148, an upper readout plug 152is disposed penetrating the second insulation film 150.

The buffering insulation film 128 and the plugs of the bufferinginsulation film 128, 130, 132 a, 132 b, and 134, may not be presenttherein. In this case, the MTJ structure 148 is directly connected tothe upward face of the readout semiconductor pattern 122, while thefirst and second write-in conductors 154 a and 154 b are directlyconnected to the upward faces of the first and second write-insemiconductor patterns 124 a and 124 b. Further, the second strappingplug 156 directly contacts the upward face of the strappingsemiconductor pattern 126.

Meanwhile, along with the absence of the buffering insulation film 128,the first insulation film 108 may be modified to cover the semiconductorpatterns 122, 124 a, 124 b, and 126, as shown in FIGS. 16A and 16B. Themodified first insulating film is referred to by reference numeral 108′.In this case, the lower readout plug 130, the first lower write-in plug132 a, the second lower write-in plug 132 b, and the first strappingplug 134 penetrate the first insulation film (108′ of FIG. 16A) that iscovering the semiconductor patterns 122, 124 a, 124 b, and 126. Thedevice isolation films 104 may modified to extend upward, to partiallycover the semiconductor patterns 122, 124 a, 124 b, and 126, such as,for example the device isolating films 104′ shown in FIG. 16B.

The MTJ structure 148 includes a first magnetic layer 140 with themagnetization direction pinned in a direction, a second magnetic layer144 with a variable magnetization direction, and a tunnel barrier layer142 interposed between the first and second magnetic layers 140 and 144.The first magnetic layer 140 may include a pinning layer 138 and apinned layer 139. The pinning layer 138 fixes the magnetizationdirection of the pinned layer 139 to a predetermined direction. Thepinned layer 139 contacts the tunnel barrier layer 142. It is preferablefor the magnetization direction of the first magnetic layer 140 to befixed to one of the first and second directions. The magnetizationdirection in the second magnetic layer 144 is arranged along the firstdirection by the first-directional electric field generated from thefirst write-in conductor 154 a during the first programming mode.Otherwise, the magnetization direction in the second magnetic layer 144may be arranged along the second direction by the second-directionalelectric field generated from the second write-in conductor 154 b duringthe second programming mode. In addition, it is preferable for thesecond magnetic layer 144 to retain its magnetization direction in thedirection arranged by the first or second programming mode during thereading or/and standby operation.

The pinned layer 138 may be made up of, for example, ananti-ferromagnetic material. For instance, the pinned layer 138 is maybe formed of, for example, ferrous manganese (FeMn), iridium manganese(IrMn), platinum manganese (PtMn), manganic oxide (MnO), manganicsulfide (MnS), manganic telluride (MnTe), manganic fluoride (MnF₂),ferrous fluoride (FeF₂), ferrous chloride (FeCl₂), ferrous oxide (FnO),cobaltic chloride (CoCl₂), nickel chloride (NiCl₂), nickel oxide (NiO),or chrome (Cr). The pinning layer 138 and the second magnetic layer 140may be made up with, for example, a anti-ferromagnetic materialcontaining iron, nickel, or cobalt, such as cobaltic iron (CoFe), nickeliron (NiFe), or cobaltic ferro-boride (CoFeB). The pinning layer 138 andthe second magnetic layer 140 may be formed of the same ferromagneticmaterial or different ferromagnetic materials from each other. Thetunnel barrier layer 142 may be formed of, for example, aluminum oxideor magnesium oxide.

The MTJ structure 148 may further include lower and upper electrodes 136and 146. The lower and upper electrodes 136 and 146 may be formed of,for example, a conductive material with low reactivity, e.g., aconductive metal nitride such as titanium nitride or tantalum nitride.The lower electrode 136 contacts with the lower readout plug 136 or thereadout semiconductor pattern 122, while the upper electrode 146contacts the upper readout plug 152.

Moreover, the first magnetic layer 140 may contact the lower electrode136 and the second magnetic layer 144 may contact the upper electrode146. Namely, sequentially stacked on the substrate are the lowerelectrode 136, the pinning layer 138, the pinned layer 139, the tunnelbarrier layer 142, the second magnetic layer 144, and the upperelectrode 146. Otherwise, the second magnetic layer 144 may contact thelower electrode 136 and the first magnetic layer 140 may contact theupper electrode 146. Namely, sequentially stacked on the substrate 100are the lower electrode 136, the second magnetic layer 144, the tunnelbarrier layer 142, the pinned layer 139, the pinning layer 138, and theupper electrode 146.

Referring to FIGS. 4, 5, 6, and 7, a readout line 158 is arranged on thesecond insulation film 150, crossing the common line 106. The readoutline 158 is connected with the upper readout plug 152, electricallylinking to the MTJ structure 148. The readout line 158 may be connectedto a plurality of MTJ structures 148 arranged along a column. Thereadout line 158 is correspondent with the readout line RD or RD′ shownin FIG. 2A or 2B. The readout line 148 is formed of a conductivematerial. For instance, the readout line 148 may contain, for example, ametal such as tungsten, aluminum, or copper.

First and second landing patterns 160 a and 160 b may be disposed on thesecond insulation film 150, and may be connected to the first and secondwrite-in conductors 154 a and 154 b. The first and second landingpatterns 160 a and 160 b are located at both sides of the readout line158, and are separate from each other. The first and second landingpatterns 160 a and 160 b may be formed of the same material as thereadout line 158. On the second insulation film 150, a first strappinglanding pattern 162 may be connected to the second strapping plug 156.The first strapping landing pattern 162 may be also formed of the samematerial as the readout line 158.

A third insulation film 164 covers the readout pattern 158, the secondinsulation film 150, and the lading patterns 160 a, 160 b, and 162. Thefirst and second write-in lines 170 a and 170 b are disposed on thethird insulation film 164. The first and second write-in lines 170 a and170 b cross over the common source line 106. The first and secondwrite-in lines 170 a and 170 b are located at both sides of the readoutline 158, being in parallel with the readout line 158. The first andsecond write-in lines 170 a and 170 b are correspondent with the firstand second write-in lines WL1 and WL2 shown in FIG. 2A or 2B.

The first write-in line 170 a is connected to a first upper write-inplug 166 a that penetrates the third insulation film 164 and links withthe first write-in landing pattern 160 a. Namely, the first write-inline 170 a is electrically connected to the first write-in conductor 154a by way of the first upper write-in plug 166 a and the first write-inlanding pattern 160 a. The second write-in line 170 b is connected to asecond upper write-in plug 166 b that penetrates the third insulationfilm 164 and links with the second write-in landing pattern 160 b.Namely, the second write-in line 170 b is electrically connected to thesecond write-in conductor 154 b by way of the second upper write-in plug166 b and the second write-in landing pattern 160 b. The first write-inline 170 a is electrically connected to a plurality of the firstwrite-in conductor 154 a arranged along a column, while the secondwrite-in line 170 b is electrically connected to a plurality of thesecond write-in conductor 154 b arranged along a column. The first andsecond write-in lines 170 a and 170 b are formed of a conductivematerial. For instance, the first and second write-in lines 170 a and170 b may contain, for example, a metal such as tungsten, aluminum, orcopper.

The first and second write-in lines 170 a and 170 b are formed higherthan the third insulation film 164 that is covering the readout line158, and thus the first and second write-in lines 170 a and 170 b arealso formed higher than the readout line 158. Consequently, the firstand second write-in lines 170 a and 170 b are isolated far from the MTJstructures 148 sharing the first and second write-in lines 170 a and 170b in the magnetic memory cell. As a result, electric fields, which aregenerated from the first and second write-in lines 170 a and 170 b, areprevented from affecting the MTJ structures 148 of deselected cellsduring the programming operation.

Penetrating the third insulation film 164 on the first strapping landingpattern 162, a third strapping plug 168 may be connected to the firststrapping landing pattern 162. On the third insulation film 164, asecond strapping landing pattern 172 may be connected to the thirdstrapping plug 168. The second strapping landing pattern 172 may beformed of the same material as the first and second write-in lines 170 aand 170 b.

A fourth insulation film 174 covers the third insulation film 164, thewrite-in lines 170 a and 170 b, and the second strapping landing pattern172. On the fourth insulation film 174, a strapping line 178 is arrangedsuch that it crosses the write-in lines 170 a and 170 b and the readoutline 158. The strapping line 178 is disposed over the common line 106 inparallel therewith. The strapping line 178 is connected to a fourthstrapping plug 176 that penetrates the fourth insulation film 174 tolink with the second strapping landing pattern 172. Namely, thestrapping line 178 is electrically connected to the common line 106. Itis preferable for the strapping line 178 to be made up with a conductivematerial having a lower resistivity than that of the common line 106.For example, the strapping line 178 may contain, for example, a metalsuch as tungsten, copper, or aluminum. With the strapping line 178voltage signals may be readily supplied to the common line 106 for thereading or programming operation.

One of the common line 106 and the readout line 158 is correspondentwith the word line, while the other is correspondent with the bit line.In other words, one of the common line 106 and the readout line 158 maybe led to a first selection decoder, while the other may be led to asecond selection decoder and a sense amplifier.

An operational scheme for a magnetic memory device in accordance withthe exemplary embodiments of the present invention depicted in FIGS. 2A,2B, and 3 will now be described in more detail.

According to the magnetic memory device described above, it uses onlythe first-directional electric field, which is generated from the firstwrite-in conductor 154 a, during the first programming mode, while usingonly the second-directional electric field, which is generated from thesecond write-in conductor 154 b, during the second programming mode.Thus, program disturbance may be minimized and a processing margin mayimprove in manufacturing the device.

Further, the first and second write-in conductors 154 a and 154 b arelocated at both sides of the MTJ structure 148 in the form of contactplugs. Thus, the first and second write-in currents flow through thefirst and second write-in conductors 154 a and 154 b, being suppliedvertically to a selected cell. As a result, the cell selectivity issignificantly improved by the electric fields generated with the firstand second write-in currents, so that the conventional programdisturbance may be reduced. The cell selectivity may be defined, forexample, by degrees of freedom in the MTJ structures of the deselectedcells from the electric fields for programming data in the MTJ structureof the selected cell. In other words, improving the cell selectivity maymean, for example, that the electric field used for programming data inthe selected cell has a decreased affect on the MTJ structures of thedeselected cells.

In addition, the unit cell of the magnetic memory device each includesthe first and second write-in conductors 154 a and 154 b. In otherwords, the unit cells do not share the first and second write-inconductors 154 a and 154 b. Thus, the first and second write-inconductors 154 a and 154 b are isolated relatively far from the adjacentMTJ structure 148. For instance, the distance between the write-inconductors 154 a and 154 b of a first unit cell and the MTJ structure ofthe first cell is shorter than that between the write-in conductors 154a and 154 b of the first unit cell and the MTJ structure of a secondcell adjacent to the first cell. As a result, the effect of the electricfield, which is generated by the write-in conductors 154 a and 154 b,toward the MTJ structures 148 of the adjacent cells may be minimized.Therefore, the improved cell selectivity for the electric field by thewrite-in conductors 154 a and 154 b contributes to minimizing theprogram disturbance.

Moreover, the first and second write-in lines 170 a and 170 b arepositioned higher than the readout line 158, so that they are isolatedfar from the MTJ structure 148 sharing them. As a result, the effect ofelectric field, which is generated by the write-in conductors 154 a and154 b to which the write-in currents are applied, toward the MTJstructures 148 of the deselected cells may be minimized. Therefore, theprogram disturbance may be significantly reduced.

FIGS. 8 through 13 are sectional views illustrating processing steps tofabricate the magnetic memory device in accordance with an exemplaryembodiment of the invention, taken along with the line I-I′ of FIG. 4.

Referring to FIG. 8, the device isolation films are formed in thesemiconductor substrate 100 of a first conductivity, confining theactive regions 105 shown in FIG. 4. The device isolation films may beformed in trench types. The substrate 100 of the first conductivity mayinclude a well doped with impurities of the first conductivity. Thesubstrate 100 may be, for example, a silicon, germanium, orsilicon-germanium substrate.

The common line 106 is formed in the active region by injectingimpurities of the second conductivity. The common line 106 is formed inthe pattern of lines. The common line may be formed after completing thedevice isolation films. Otherwise, the device isolation films may beformed after forming impurity-doped layers of the second conductivity inthe substrate 100 of the second conductivity and forming trenches bysequentially patterning the impurity-doped layers and the substrate 100.Here, the patterned impurity-doped layers of the second conductivity arecorrespondent with the common line 106.

The first insulation film 108 is deposited on the overall structure ofthe substrate 100. The first insulation film 108 may be made of siliconoxide. Subsequently, the first insulation film 108 is patterned to formreadout openings 110 and first and second write-in openings 112 a and112 b which are each located at both sides of the readout openings 110.The readout openings 110, and the first and second write-in openings 112a and 112 b are separated from each other, each partially exposing thecommon line 106. While forming the readout openings 110, and the firstand second write-in openings 112 a and 112 b, a strapping opening 114may be also formed to expose the strapping region.

Referring to FIGS. 9 and 10, semiconductor layers 116 are formed in theopenings 110, 112 a, 113 b, and 114. The semiconductor layers 116 arepreferably formed by means of epitaxial growth. According to this, thesemiconductor layers 116 may be formed of, for example, a singlecrystalline semiconductor.

Thereafter, the readout buffering patterns 118, and the first and secondwrite-in buffering patterns 120 a and 120 b are each formed at lowerportions of the semiconductor layers 116 that are positioned in thereadout openings 110, and the first and second write-in openings 112 aand 112 b. The buffering patterns 118, and 120 a and 120 b are dopedwith impurities of the second conductivity. It is preferable for thebuffering patterns 118, and 120 a and 120 b to be lower than the commonline 106 in impurity concentration. In addition, the readout bufferingpatterns 122, and the first and second write-in semiconductor patterns124 a and 124 b are each formed at upper portions of the semiconductorlayers 116 that are positioned in the readout openings 110, and thefirst and second write-in openings 112 a and 112 b. The semiconductorpatterns 122, 124 a, and 124 b are doped with impurities of the firstconductivity.

The buffering patterns 118, 120 a, and 120 b are completed byselectively injecting ionic impurities into the lower portions of thesemiconductor layers 116, while the semiconductor patterns 122, 124 a,and 124 b are completed by selectively injecting ionic impurities intothe upper portions of the semiconductor layers 116.

An alternative method for forming the buffering patterns 118, 120 a, and120 b and the semiconductor patterns 122, 124 a, and 124 b, will be nowbe described in more detail. First, impurities of the secondconductivity are doped in-situ when the semiconductor layers 116 aregrowing up by means of the epitaxial growth. During this, the impuritiesof the second conductivity are controlled to be lower in concentrationthan the impurity concentration of the common line 106. Next, ionicimpurities are injected into the upper portions of the semiconductorlayers 116, forming the semiconductor patterns 122, 124 a, and 124 b.Here, the lower portions of the semiconductor layers 116 under thesemiconductor patterns 122, 124 a, and 124 b are correspondent with thebuffer patterns 118, 120 a, and 120 b.

Ionic impurities are injected into the semiconductor layer 116 of thestrapping opening 114, forming the strapping semiconductor pattern 126.The impurity concentration of the strapping semiconductor pattern 126may be adjusted near to that of the common line 106.

One of the first and second conductivities may be an N-type, while theother may be a P-type.

Referring to FIG. 11, the buffering insulation film 128 is deposited onthe overall structure of the substrate 100. The buffering insulationfilm 128 may be formed of, for example, a silicon oxide. Next, the lowerreadout plug 130, the first and second lower write-in plugs 132 a and132 b, and the first strapping plug 134 are formed to penetrate thebuffering insulation film 128. The lower readout plug 130 is connectedto the readout semiconductor pattern 122, while the first and secondlower write-in plugs 132 a and 132 b are each connected to the first andsecond semiconductor patterns 124 a and 124 b. The first strapping plug134 is connected to the strapping semiconductor pattern 126.

The plugs 130, 132 a, 132 b, and 134 are made up of conductivematerials. For example, the plugs 130, 132 a, 132 b, and 134 may beformed of a metal such as tungsten, copper, or aluminum, a conductivemetallic nitride such as titanium nitride or tantalum nitride, or ametallic silicide. The plugs 130, 132 a, 132 b, and 134 may contain, forexample, a metallic silicide contacting with the semiconductor patterns122, 124 a, 124 b, and 126.

The MTJ structures 148 are formed on the buffering insulation film 128.The MTJ structures 148 are each located over the readout semiconductorpatterns 122, and each of the MTJ structures are connected to the lowerreadout plugs 130. The MTJ structures are electrically connected to thereadout semiconductor patterns 122.

The MTJ structure 148 may include the lower electrode 136, the firstmagnetic layer 140, the tunnel barrier layer 142, the second magneticlayer 144, and the upper electrode 146 stacked in sequence. The firstmagnetic layer 140 includes the pinning layer 138 and the pinned layer139 stacked in sequence. Alternatively, the MTJ structure 148 may besubstituted with the first and second magnetic layers 140 and 144 inposition. Namely, the MTJ structure 148 may include the lower electrode136, the second magnetic layer 144, the tunnel barrier layer 142, thefirst magnetic layer 140, and the upper electrode 146 stacked insequence. In this case, the first magnetic layer 140 includes the pinnedlayer 139 and the pinning layer 138 stacked in sequence.

The characteristics and materials of the lower electrode 136, the firstmagnetic layer 140, the tunnel barrier layer 142, the second magneticlayer 144, and the upper electrode 146 of the present exemplaryembodiment are the same as in the exemplary embodiment depicted in FIGS.4 through 7.

The processing steps of forming the buffering insulation film 128 andthe plugs 130, 132 a, 132 b, and 134 may be omitted. In this case, theMTJ structures 148 directly contact the readout semiconductor patterns122. During this, the lower electrode 136 may further contain, forexample, a metal silicide contacting the readout semiconductor pattern122.

Referring to FIG. 12, the second insulation film 150 is deposited on theoverall structure of the substrate 100. The second insulation film 150may be formed of, for example, a silicon oxide. Next, the upper readoutplug 152, the first and second write-in conductor 154 a and 154 b, andthe second strapping plug 156 are formed penetrating the secondinsulation film 150.

The first and second write-in conductors 154 a and 154 b are disposed atboth sides of the MTJ structure 148. The first and second write-inconductors 154 a and 154 b are each connected to the first and secondlower plugs 132 a and 132 b, and electrically lead to the first andsecond write-in semiconductor patterns 124 a and 124 b, respectively.The first and second write-in conductors 154 a and 154 b are formed inthe pattern of contact plugs. The upper readout plug 152 is connected tothe upward face of the MTJ structure 148. The second strapping plug 156is connected to the first strapping plug 134, and electrically leads tothe common line 106.

The first and second write-in conductors 154 a and 154 b are formed of,for example, a metal such as tungsten, copper, or aluminum, a conductivemetallic nitride such as titanium nitride or tantalum nitride, or ametallic silicide. The upper readout plug 152 and the second strappingplug 156 may be made up of the same material as the first and secondwrite-in conductors 154 a and 154 b.

Without the buffering insulation film 128 and the plugs 130, 132 a, 132b, and 134 in the buffer insulation film 28, the first and secondwrite-in conductors 154 a and 154 b and the second strapping plug 156may contact directly with the first and second write-in semiconductorpatterns 124 a and 124 b, and the strapping semiconductor pattern 126,respectively. In this case, the first and second write-in conductors 154a and 154 b and the second strapping plug 156 may contain, for example,a metal silicide contacting the semiconductor patterns 124 a, 124 b, and126.

Subsequently, a first line conductive film is deposited on the secondinsulation film 150 and patterned to form the readout lines 158, whichcross over the common lines 106, over the MTJ structures 148. Thereadout line 158 links with the upper readout plug 152, electricallyconnected to the MTJ structure 148. The readout line 158 may be formedof, for example, a metal such as tungsten, copper, or aluminum, aconductive metallic nitride such as titanium nitride or tantalumnitride, or a metallic silicide.

While patterning the first line conductive film, the first and secondlanding patterns 160 a and 160 b may further be formed on the first andsecond write-in conductors 154 a and 154 b. In addition hereto, during astep of patterning the first line conductive film, the first strappinglanding pattern 162 may further be formed on the second strapping plug156. The landing patterns, 160 a, 160 b, and 162, form parts of thefirst line conductive film and are made of the same material as thereadout line 158.

Referring to FIG. 13, the third insulation film 164 is deposited on theoverall structure of the substrate 100. The third insulation film 164may be formed of, for example, a silicon oxide. The third insulationfilm 164 can be flattened through, for example, a planarization process.

The first and second upper write-in plugs 166 a and 166 b and the thirdstrapping plug 168 are each formed to penetrate the third insulatingfilm 164. Moreover, the first and second upper write-in plugs 166 a and166 b and the third strapping plug 168 are each connected with the firstand second write-in landing patterns 160 a and 160 b, and the firststrapping landing pattern 162, respectively. The plugs, 166 a, 166 b,and 162, may be formed of a metal such as, for example, tungsten,copper, or aluminum, a conductive metallic nitride such as titaniumnitride or tantalum nitride, or a metallic silicide.

Thereafter, a second line conductive film is deposited on the thirdinsulation film 164 and is patterned to form the first and secondwrite-in lines 170 a and 170 b, which cross over the common lines 106 inparallel and are each connected to the first and second upper write-inplugs 166 a and 166 b. While patterning the second line conductive film,the second strapping landing pattern 172 may further be formed connectedto the third strapping plug 168. The second strapping landing pattern172, as part of the second line conductive film, is formed of the samematerial as the write-in lines 170 a and 170 b. The write-in lines 170 aand 170 b may be formed of, for example, a metal such as tungsten,copper, or aluminum, a conductive metallic nitride such as titaniumnitride or tantalum nitride, or a metallic silicide.

The fourth insulation film 174 is deposited to entirely or at leastsubstantially entirely cover the substrate 100. The fourth insulationfilm 174 may be flattened on its upward face. The fourth insulation film174 may be formed of, for example, a silicon oxide. Subsequently, thefourth strapping plug 176 is formed penetrating the fourth insulationfilm 174, and connected to the second strapping landing pattern 172. Thefourth strapping plug 176 may contain a conductive material such as, forexample, a metal or/and conductive metallic nitride.

The strapping line 178 is formed on the fourth insulation film 174 asshown in FIG. 4, 5, 6, or 7. The strapping line 178 may be formedcontaining, for example, a metal or/and conductive metallic nitride.

The diodes including the semiconductor patterns 122, 124 a, and 124 bmay be completed as described below.

FIGS. 14A through 16A are sectional views illustrating processing stepsto form the diodes of the magnetic memory device in accordance with anexemplary embodiment of the invention, taken along with the line I-I′ ofFIG. 4, and FIGS. 14B through 16B are sectional views illustratingprocessing steps to form the diodes of the magnetic memory device inaccordance with another exemplary embodiment of the invention, takenalong with the line II-II′ of FIG. 4.

Referring to FIGS. 14A and 14B, ionic impurities of a secondconductivity are injected into the substrate 100 of a firstconductivity, forming a first doped layer 201 having a predetermineddepth. Additionally, ionic impurities of the second conductivity arefurther injected into the substrate 100, forming a second doped layer202 on the first doped layer 201 having a predetermined depth. Thesecond doped layer 202 is preferably lower than the first doped layer inimpurity concentration.

Thereafter, ionic impurities of the first conductivity are furtherinjected into the substrate 100, forming a third doped layer 203 on thesecond doped layer 202. In addition, ionic impurities of the secondconductivity are still further injected into a predetermined region ofthe substrate 100, which includes the strapping region aforementionedwith reference to FIG. 4, 5, 6, or 7, forming a fourth doped layer 204.The ionic impurities of the first conductivity, which have been used forthe third doped layer 203, may not be injected into the region of thefourth doped layer 204. The fourth doped layer 204 is positioned on thefirst doped layer 201. The fourth doped later 204 may be formedincluding the strapping region and the regions where the deviceisolation films are disposed at both sides of the strapping region. Thethird and fourth doped layers 203 and 204 may be formed level with thesubstrate 100.

Next, referring to FIGS. 15A and 15B, the fourth, third, second, andfirst doped layers, 204, 203, 202, and 201, and the substrate 100, arepatterned in sequence, to form trenches 103, which define the activeregions 105, and the common lines 106 in the active regions 105. Thecommon line 106 is formed as a part of the first doped layer 201.

In the active region 105, the patterned common line 106, a patternedsecond doped layer 202 a, and a patterned third doped layer 203 a arestacked in sequence. The patterned doped layers 202 a and 203 a arearranged in the form of lines. Also, a patterned fourth doped layer 204a is also disposed in a predetermined region of the common line 106.

Next, device isolation films 104′ are formed filling up the trenches103. The device isolation films 104′ may cover both sides of the commonline 106 and the patterned doped layers 202 a, 203 a, and 204 a. Thedevice isolation films 104′ may be formed in the pattern of the formerdevice isolation films 104 shown in FIGS. 6 and 7 by an additionalprocessing step for recessing their upward faces.

Referring to FIGS. 16A and 16B, the patterned doped layers 203 a and 202a, and 204 a are further patterned to form the buffer patterns 120 a,118, and 120 b, and the semiconductor patterns 124 a, 122, and 124 b.

On the common line 106, the readout buffering pattern 118, and the firstand second write-in buffering patterns 120 a and 120 b are laterallyarranged in sequence. The readout semiconductor pattern 122, and thefirst and second write-in semiconductor patterns 124 a and 124 b areeach disposed on the readout buffering pattern 118, and the first andsecond write-in buffering patterns 120 a and 120 b. The strappingsemiconductor pattern 126 is formed on the strapping region. The readoutbuffering pattern 118, and the first and second write-in bufferingpatterns 120 a and 120 b are formed as part of the patterned seconddoped layer 202 a, while the readout semiconductor pattern 122, and thefirst and second write-in semiconductor patterns 124 a and 124 b areformed as part of the patterned third doped layer 203 a. The strappingsemiconductor pattern 126 is formed as a part of the patterned fourthdoped layer 204 a.

A first insulation film 108′ is deposited on the overall structure ofthe substrate 100, covering the semiconductor patterns 122, 124 a, 124b, and 126. Thereafter, the lower readout plug 130, the first and secondlower write-in plugs 132 a and 132 b, and the first strapping plug 134are each connected to the readout write-in semiconductor pattern 122,the first and second write-in semiconductor patterns 124 a and 124 b,and the strapping semiconductor pattern 126, thereby also penetratingthe first insulation film 108′. The MTJ structure 148 is formed on thefirst insulation film 108′ and is connected with the lower readout plug130. The post-processing steps are carried out in the same manner asthose methods aforementioned with reference to FIGS. 12 and 13.

Furthermore, the insulation film 108 shown in FIG. 10 may be formed byflattening the first insulation film 108′ until the semiconductorpatterns 122, 124 a, 124 b, and 126 are exposed. In this case, thepost-processing steps are also carried out in the same manner as thosemethods aforementioned with reference to FIGS. 12 through 13.

As stated above, the magnetic memory device in accordance with exemplaryembodiments of the invention includes a first write-in conductordisposed at a side of the MTJ structure and is used for a firstprogramming mode, and a second write-in conductor disposed at the otherside of the MTJ structure is used for a second programming mode. Themagnetic memory device employs a single electric field during theprogramming operation. From this scheme, the magnetic memory device ofexemplary embodiments of the invention does not need a precise alignmentprocess for the MTJ structure and lines. As a result, the magneticmemory device of the exemplary embodiments of the present invention mayminimize program disturbance and also provide an improved processingmargin because the device may be formed without significant reliance onan alignment process.

Moreover, with the magnetic memory device of the exemplary embodiments,as the write-in currents flowing through the first and second write-inconductors, which are formed in the pattern of contact plugs, arevertically supplied toward a selected cell, the cell selectivity may besignificantly improved by the electric field generated from the write-inconductors. As a result, the program disturbance of the magnetic memorydevice may be reduced.

Having described the exemplary embodiments of the present invention, itis further noted that it is readily apparent to those of reasonableskill in the art that various modifications may be made withoutdeparting from the spirit and scope of the invention which is defined bythe metes and bounds of the appended claims.

1. A method of fabricating a magnetic memory device, the methodcomprising: forming a device isolation film to confine an active regionat a substrate having impurities of a first conductivity; forming acommon line having impurities of a second conductivity in the activeregion; forming a first write-in semiconductor pattern, a readoutsemiconductor pattern and a second write-in semiconductor pattern, witheach being disposed on the common line laterally separated from eachother, and each having impurities of the first conductivity; forming amagnetic tunnel junction structure on the readout semiconductor pattern,the magnetic tunnel junction structure being electrically connected tothe readout semiconductor pattern; forming first and second write-inconductors each on the first and second write-in semiconductor patternsat both lateral sides of the magnetic tunnel junction structure, suchthat the first and second write-in conductors are each electricallyconnected with the first and second write-in semiconductor patterns;forming a readout line which is electrically connected to the magnetictunnel junction structure; foaming first and second write-in lines whichare each electrically connected with the first and second write-inconductors; forming a first write-in buffering pattern between the firstwrite-in semiconductor pattern and the common line; forming a readoutbuffering pattern between the readout semiconductor pattern and thecommon line; and forming a second write-in buffering pattern between thesecond write-in semiconductor pattern and the common line, wherein thereadout buffering pattern, and the first and second write-in bufferingpatterns are semiconductors having impurities of the secondconductivity, and wherein an impurity concentration of each of thereadout buffering pattern, and the first and second write-in bufferingpatterns is lower than an impurity concentration of the common line. 2.The method of claim 1, wherein one of the first and secondconductivities is an N-type, while the other of the first and secondconductivities is a P-type.
 3. A method of fabricating a magnetic memorydevice, the method comprising: forming a device isolation film toconfine an active region at a substrate having impurities of a firstconductivity; forming a common line having impurities of a secondconductivity in the active region; forming a first write-insemiconductor pattern a readout semiconductor pattern and a secondwrite-in semiconductor pattern with each being disposed on the commonline laterally separated from each other, and impurities of the firstconductivity; forming a magnetic tunnel junction structure on thereadout semiconductor pattern, the magnetic tunnel junction structurebeing electrically connected to the readout semiconductor pattern;forming first and second write-in conductors each on the first andsecond write-in semiconductor patterns at both lateral sides of themagnetic tunnel junction structure, such that the first and secondwrite-in conductors are each electrically connected with the first andsecond write-in semiconductor patterns; forming a readout line which iselectrically connected to the magnetic tunnel junction structure;forming first and second write-in lines which are each electricallyconnected with the first and second write-in conductors; forming a firstinsulation film on the substrate; forming a second insulation film tocover the first insulation film, the readout semiconductor pattern, thefirst and second write-in semiconductor patterns, and the magnetictunnel junction structure; and forming an upper readout plug penetratingthe second insulation film and which is connected to an upward face ofthe magnetic tunnel junction structure, wherein the first and secondwrite-in conductors each have plug shapes and penetrate the secondinsulation film, and the readout line is formed on the second insulationfilm to be connected to the upper readout plug.
 4. The method of claim3, further comprising: forming a third insulation film to cover thesecond insulation film and the readout line; and forming first andsecond upper write-in plugs penetrating the third insulation film andwhich are electrically connected with the first and second write-inconductors, respectively, wherein the first and second write-in linesare formed on the third insulation film connected to the first andsecond upper write-in plugs, respectively.
 5. The method of claim 3,wherein the forming of the readout semiconductor pattern, and the firstand second write-in semiconductor patterns comprises: depositing thefirst insulation film on the substrate; patterning the first insulationfilm to form a first write-in opening, a readout opening, and a secondwrite-in opening that are separated from each other and which expose thecommon line; and forming the first write-in semiconductor pattern, thereadout semiconductor pattern and the second write-in semiconductorpattern in the first write-in opening, the readout opening and thesecond write-in opening, respectively.
 6. The method of claim 5, whereinthe first write-in conductor, the magnetic tunnel junction structure,and the second write-in conductor directly contact with upward faces ofthe first write-in semiconductor pattern, the readout semiconductorpattern, and the second write-in semiconductor pattern, respectively. 7.The method of claim 5, further comprising: forming a bufferinginsulation film to cover the first insulation film, the first write-insemiconductor pattern, the readout semiconductor pattern, and the secondsemiconductor pattern; and forming a lower readout plug and first andsecond lower write-in plugs penetrating the buffering insulation film,wherein the lower readout plug and the first and second lower write-inplugs are each connected with the readout semiconductor pattern, and thefirst and second write-in semiconductor patterns, respectively, whereinthe first write-in conductor, the magnetic tunnel junction structure,and the second write-in conductor are each connected with the firstlower write-in plug, the lower readout plug, and the second lowerwrite-in plug, respectively.
 8. The method of claim 3, wherein theforming of the device isolation film, the common line, the readoutsemiconductor pattern, and the first and second write-in semiconductorpatterns comprises: forming a doped layer of the second conductivity anda doped layer of the first conductivity, each stacked in the substrate;patterning the doped layer of the first conductivity, the doped layer ofthe second conductivity and the substrate to form a trench that definesthe active region; forming the device isolation film in the trench; andpatterning the patterned doped layer of the first conductivity to formthe first write-in semiconductor pattern, the readout semiconductorpattern and the second write-in semiconductor pattern, wherein thepatterned doped layer of the second conductivity is the common line. 9.The method of claim 8, wherein the first insulation film is formed tocover the substrate, the readout semiconductor pattern, and the firstand second write-in semiconductor patterns, and further comprising:forming a lower readout plug and first and second lower write-in plugspenetrating the first insulation film to such that each of the lowerreadout plug, the first and the second lower write-in plugs areconnected with the readout semiconductor pattern, and the first andsecond write-in semiconductor patterns, respectively, wherein the firstwrite-in conductor, the magnetic tunnel junction structure, and thesecond write-in conductor are each connected with the first lowerwrite-in plug, the lower readout plug, and the second lower write-inplug, respectively.
 10. The method of claim 3, wherein one of the firstand second conductivities is an N-type, while the other of the first andsecond conductivities is a P-type.